CCL Copper Clad Laminate Inoshandiswa PCB
Get Latest PriceMutero Wechibharo: | T/T,Paypal |
Incoterm: | FOB,CFR,CIF,EXW,DDU |
Min. Raira: | 1 Kilogram |
Kutakura: | Ocean,Land,Air,Express |
Port: | Shenzhen,Guangzhou,Hongkong |
Mutero Wechibharo: | T/T,Paypal |
Incoterm: | FOB,CFR,CIF,EXW,DDU |
Min. Raira: | 1 Kilogram |
Kutakura: | Ocean,Land,Air,Express |
Port: | Shenzhen,Guangzhou,Hongkong |
Muenzaniso Nha.: HONY-Copper Clad Laminate
Mutengo: Hony
Kutengesa Units | : | Kilogram |
Package Rudzi | : | Kutumira kunze kwenyika |
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Copper Clad Laminated Sheet inoshandisa girazi fiber jira seyakajeka zvinyorwa. Mushure mekunyudzwa neepeni resin uye yakabva yabikwa prepreg sheet, akati wandei masheti anobva abatanidzwa nedivi rekunyepedzera uye kupora Kugadzikana uye michina Iyo substrate yakagadzirwa ne fr4 iyo iri murazvo unodzoreredza shanduro yeG-10 zvinhu. Copper Clad Fr-4 pepa rinoshandiswa kugadzira mabhodhi wedunhu wedunhu.
Copper Clad Laminate (ccL) ndeye magetsi fiberglass jira kana zvimwe zvekusimbisa zvisingaiti neyekuita Vakasiyana-siyana emhando dzakasiyana, mabasa akasiyana ebhodhi redunhu rakadhindwa, vakasarudzwa zvakasarudzwa pane ndiro yemhangura, yekukweva, inodhirowa uye yemhangura-makatenderedza. Mabhodhi ematunhu akadhindwa anonyanya kuita basa rekusimbisa, kusimbisa uye kutsigirwa, kusaratidzwa kwenyika, saka, kuita kwemabhodhi edunhu redunhu, mhando, yekugadzira, yekugadzira mwero , Kugadzira mari uye kuvimbika kwenguva refu kunoenderana zvakanyanya pamapuranga emhangura.
Item Name | FR-4 Copper clad laminate | Copper Thickness | 18um,25um,35um,70um |
Size | 40*48inch,41*49inch,43*49inch | Color | yellow/white/green/grey |
Thickness |
0.4mm,0.8mm,1mm,1.2mm, 1.6mm,2.4mm |
Glass Transition Temperature |
135-155 °C |
Copper Clad Laminate (ccl) idunhu rezvinyorwa zvekatanga nedunhu remhangura rakafukidzwa pamusoro penzvimbo yekuita substrate ine zvivakwa zvinogadzirisa, simba rakanaka uye kusimba kwakanaka. Iyo inonyanya kushandiswa muindasitiri yemagetsi, indasitiri yemotokari uye indasitiri yemotokari uye imwe minda. Muindasitiri yemagetsi, mhangura-copper-clad laminates inoshandiswa zvakanyanya mumarenda, makomputa uye zvimwe zvigadzirwa padunhu redunhu. Muindasitiri wekudyidzana, inonyanya kushandiswa muVemy memory Module, Network Equind uye Broadband zvishandiso uye mamwe matunhu ematunhu. Mune indasitiri yemotokari, inonyanya kushandiswa mune emagetsi ekudzora masisitimu, mota Audio uye zvimwe zvigadzirwa.
Hunhu hwemhangura-clad board
1.Kunhamisika kwakanaka: Iyo yekunze danda remhangura rakaputira rakaputirwa rakafukidzwa nemhangura foil pane iyo nzira yekufambisa, iyo inogona kupa zvakanaka.
2. Pfeka kupokana: pamusoro penzvimbo yemhangura-copper-copper-clad iri flat yakakwenenzverwa, saka ine yakanaka kupfeka kurwisa.
3. Corrosion Rishance: Pasi pechisimba-copper-clad plate ine dura yemhangura nzombe, iyo inogona kudzivirira oxidation uye corrosion.
4. Kugadziriswa kwakanaka: mhangura-copper-copper-clad laminates zviri nyore kuita mumhando dzakasiyana siyana uye saizi.
Kunyangwe iyo mhangura-copper-clad laminate ndeyekubatanidzwa kwedunhu
Copper-Clad Laminate idunhu redunhu, basa rayo rekushanda seyekubatanidza kutakura kwezvemagetsi zvinhu. Zvikamu zvakabatanidzwa huwandu hukuru hwemagetsi zvikamu zvakabatanidzwa pamwechete kuti ugadzire dunhu rese chip. Naizvozvo, marara emhangura haasi mashoma matunhu.
Mukupfupikisa, kupururudza kwemhangura kwakashandiswa nedunhu redunhu zvakanyanya, pfeka zvakashata, kupokana nekuita basa uye humwe hunhu, uye indasitiri yemitambo, uye indasitiri yekutaurirana, uye indasitiri yemotokari. Copper-copper leminate uye kushumirwa matunhu akasiyana, haazi weboka rematunhu akabatanidzwa.
Zvishandiso:
Chemical machiny zvikamu, General machiny zvikamu
Magiya, vaGenesi, mapads, zvigadziko, mabheji, jenareta, transformer, fixture inverter, mota uye yemagetsi insulation chikamu.
Bhokisi rekugovera, fixture board, iyo mold ndiro, yakakwirira uye yakaderera voltage yekugovera bhokisi, kurongedza machina muzvimedu zvikamu zvekusimbisa zvikamu.
MOLD Kugadzira, PCB, ICT Fixture, Maling Machine, Machina Anodhonzera, Mesa Grinding Pads etc.
Test Item | Test Condition | Unit | SPEC | Typical Value |
Tg | DSC | °C | ≥125 | 135 |
Thermal Stress | 288°C,10S/solder dip | – | >10 |
60S/ No delamination No Delamination |
Flexural Strength | N/mm2 | LW | ≥415 | 500 |
CW | ≥345 | 450 | ||
Flammability | E24/125 | – | UL94 V-0 | V-0 |
Surface Resistivity | After moisture | MΩ | ≥1. 0×104 | 2.0×106 |
Volume Resistivity | After moisture | MΩ.cm | ≥1.0×106 | 2.0×108 |
Dielectric | 1MHz | – | ≤5.4 | 4.7 |
Constant(1MHZ) | C-24/23/50 | |||
Dissipation Factor(1MHZ) | 1MHz C-24/23/50 | – | ≤0.035 | 0.017 |
Loss Tangent | 1MHz C-24/23/50 | – | ≤0.035 | 0.016 |
Arc Resistivity | D-48/50+D-0.5/23 | s | ≥60 | 135 |
Dielectric Breakdown | D-48/50+D-0.5/23 | KV | ≥40 | 60 |
Moisture Absorption | D-24/23 | % | ≤0.8 | 0.15 |
CTI | IEC60112 Method | V | 175~250 | 210 |
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